Evaluation of Elastic Properties of DLC Films Using Substrate Etching Techniques

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J. Korean Ceram. Soc. > Volume 35(8); 1998 > Article

Journal of the Korean Ceramic Society 1998;35(8): 813.

기판 Etching 기법을 이용한 DLC 필름의 탄성특성 평가

조성진, 이광렬¹, 은광용¹, 한준희², 고대홍³

한국과학기술연구원 박막기술연구센타
¹한국과학기술연구원 박막기술연구센터
²한국표준과학연구원 소재특성평가센터
³연세대학교 세라믹공학과

Evaluation of Elastic Properties of DLC Films Using Substrate Etching Techniques

ABSTRACT

constraint of Si substrate exhibited periodic sinusoidal shape. By measuring the amplitude and the wavelength of the sinu-soidal edge we could determine the stain of the film required to adhere to the substrate. Since the residual stress of film can be determine independently by measurement of the curvature of film-substrate com-posite we could calculated the biaxial elastic modulus E/(1-v) using stress-strain relation of thin films. By comparing the biaxial elastic modulus with the plane-strain modulus E/(1-{{{{ { v}^{2 } }}) measured by nano-in-dentation we could further determine the elastic modulus and Poisson's ratio independently. This method was employed to measure the mechanical properties of DLC films deposited by {{{{ { {C }_{6 }H }_{6 } }} rf glow discharge. The was elastic modulus E increased from 94 to 169 GPa as the {{{{ { V}_{ b} / SQRT { P} }} increased from 127 to 221 V/{{{{ {mTorr }^{1/2 } }} Poisson's ratio was estimated to be abou 0.16∼0.22 in this {{{{ { V}_{ b} / SQRT { P} }} range. For the {{{{ { V}_{ b} / SQRT { P} }} less than 127V/{{{{ {mTorr }^{1/2 } }} where the plastic deformation can occur by the substrate etching process however the present method could not be applied.

Key words: DLC films, Elastic modulus, Poisson's ratio, Nano-indenataion