| Pico-second laser cutting process for the low damage surface of polycrystal Y2O3 transparent ceramics |
Kyeonggon Choi1,3, Cheol-woo Park3, Sung-il Kim3, Seung-Wook Kim1,2, Jae-Hyoung Lee4, Baojin Chu5, Dae-Yong Jeong1,2
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1Department of Materials Science and Engineering, Inha University, Incheon, 22212, Republic of Korea
2Program in Semiconductor Convergence, Inha University, Incheon, 22212, Republic of Korea
3Corning Technology Center Korea, Corning Precision Materials, Asan, 31454, Republic of Korea
4Industry-Academic Cooperation Center, Cessmat Co., Ltd, Suwon, 16419, Republic of Korea
5Department of Materials Science and Engineering, University of Science and Technology of China, Hefei, 230026, China |
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Received: July 15, 2024; Revised: December 3, 2024 Accepted: December 29, 2024. Published online: January 21, 2025. |
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| ABSTRACT |
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Y2O3 transparent ceramics were used to demonstrate the effects of a high-precision ultra-fast laser singulation process. The ultra-fast laser singulation process achieved highly precise cutting, producing a uniform fracture surface without significant damaged areas. Even with an increased number of laser ablations from 10 to 600 times, the width of the damaged regions remained nearly constant, averaging about 48.9 μm, demonstrating the consistency and advantage of this cutting method for Y2O3 transparent ceramic materials. The ultra-fast laser offers numerous benefits, including precise cutting, minimal thermal impact zones, reduced contamination or material damage, and most importantly, cost efficiency. The measured roughness was only 0.4 μm compared to 0.9 μm roughness of mechanically broken areas. These findings can be an essential indicator of the ultra-fast laser’s singulation process to accurately cut high-density ceramics while also being economically prudent. |
| Key words:
Y2O3 · Transparent ceramic · Ultra-fast laser · Cutting process |
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