| 방전플라즈마 소결 공정을 이용한 CoSb3/Al/Ti/CuMo 접합 특성 |
| 김민숙, 안종필, 김경훈, 김경자, 박주석, 서원선, 김형순1 |
한국세라믹기술원 기업협력센터
1인하대학교 신소재공학과 |
| Joining Properties of CoSb3/Al/Ti/CuMo by Spark Plasma Sintering Process |
| Min Suk Kim, Jong Pil Ahn, Kyoung Hun Kim, Kyung Ja Kim, Joo Seok Park, Won Seon Seo, Hyung Sun Kim1 |
Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology
1School of Materials Engineering, Inha University |
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| ABSTRACT |
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$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface. |
| Key words:
$CoSb_3$, Thermoelectric, Spark plasma sintering |
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