| 에어로졸 데포지션법으로 성막된 Al2O3 후막의 유전특성 |
| 박재창, 윤영준1, 김효태1, 구은회1, 남송민2, 김종희1, 심광보3 |
요업기술원 융복합기술본부 융합기술팀, 한양대학교 신소재공학과
1요업기술원 융복합기술본부 융합기술팀
2광운대학교 전자재료공학과
3한양대학교 신소재공학과 |
| Dielectric Properties of Al2O3 Thick Films Grown by Aerosol Deposition Method |
| Jae-Chang Park, Young-Joon Yoon1, Hyo-Tae Kim1, Eun-Hae Koo1, Song-Min Nam2, Jong-Hee Kim1, Kwang-Bo Shim3 |
Division of Fusion & Convergence Technology, Korea Institute of Ceramic Engineering & Technology, Department of Ceramic Engineering Hanyang University
1Division of Fusion & Convergence Technology, Korea Institute of Ceramic Engineering & Technology
2Department of Electronic Materials Engineering Kwangwoon University
3Department of Ceramic Engineering Hanyang University
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| ABSTRACT |
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Aerosol Deposition Method (ADM) is a novel technique to grow ceramic thick films with high density and nano-crystal structure at room temperature. $^{1,2)}$ For these unique advantages of ADM, it would be applied to the fabrication process of 3-D integration ceramic modules effectively. However, it is critical to control the properties of starting powders, because a film formation through ADM is achieved by impaction and consolidation of starting powders on the substrates. We fabricated alumina thick films by ADM for the application to integral substrates for RF modules. When the as-received alumina powders were used as a starting material without any treatments, it was observed that the dielectric properties of as-deposited alumina films, such as relative permittivity and loss tangent, showed high dependency on the frequency. In this study, some techniques of powder pre-treatments to improve the dielectric properties of alumina thick films will be shown and the effects of starting powders on the properties of AD films will be discussed. |
| Key words:
Aerosol deposition, Thick film$Al_2O_3$, Integrated substrate |
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