| Nanoindenter를 이용한 MEMS 제품의 기계적 특성 측정 |
| 한준희, 박준협1, 김광석2, 이상율2 |
한국표준과학연구원 물질량표준부
1동명정보대학교 메카트로닉스공학과
2한국항공대학교 재료공학부 |
| Nanoindentation Experiments on MEMS Device |
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| ABSTRACT |
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The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $mutextrm{m}$ thick), CVD diamond film (1.6 $mutextrm{m}$ thick), SiO$_2$ film (1.0 $mutextrm{m}$ thick) and SiN film (0.43 $mutextrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${mu}$-CLB). And the elastic moduli of ${mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $mutextrm{m}$ to 58.5 $mutextrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${mu}$-CLB bending technique, moduli can be measured to within 2%. |
| Key words:
MEMS, Micro cantilever beam bending, Modulus, Strength, Nanoindentation, Ink-jet printer |
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