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J. Korean Ceram. Soc. > Volume 40(2); 2003 > Article
Journal of the Korean Ceramic Society 2003;40(2): 167.
doi: https://doi.org/10.4191/kcers.2003.40.2.167
CeO2 연마입자의 합성온도와 수계안정성이 CMP 특성에 미치는 영향
임건자, 김태은, 이종호, 김주선, 이해원, 현상훈1
한국과학기술연구원 나노재료연구센터
1연세대학교 세리믹공학과
Effects of Synthetic Temperature and Suspension Stability of CeO2 Abrasive on CMP Characteristics
CMP(Chemical Mechanical Planarization) slurry for STI process is made by mechanically synthesized$CeO_2$as abrasive. The abrasive can be stabilized by electrostatic or steric stabilization in aqueous slurry and steric stabilization is more effective for long-term stability. Blanket-type$SiO_2$and $Si_3N_4$ wafers are polished with CMP slurry containing$CeO_2$synthesized in 50$0^{circ}C$ or $700^{circ}C$. Removal rate and surface uniformity of$SiO_2$and$Si_3N_4$wafer and selectivity are influenced by synthetic condition of abrasive, suspension stability and pH of slurries.
Key words: $CeO_2$Chemical mechanical planariration, Synthetic temperature, Suspension stability, pH
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