Densification Behavior of Reaction-Bonded Silicon Nitride Prepared by Using Coarse Si Powders

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doi:2002.39.1.45

J. Korean Ceram. Soc. > Volume 39(1); 2002 > Article

Journal of the Korean Ceramic Society 2002;39(1): 45.
doi: https://doi.org/10.4191/kcers.2002.39.1.045

조대 Si입자분말을 사용한 질화반응 Si₃N₄의 치밀화 거동

이주신, 문지훈, 한병동¹, 박동수¹, 김해두¹

경성대학교 재료공학과
¹한국기계연구원 재료기술연구부

Densification Behavior of Reaction-Bonded Silicon Nitride Prepared by Using Coarse Si Powders

ABSTRACT

Effect of sintering additives on the densification behavior of reaction-bonded silicon nitride prepared by using coarse Si powders is discussed. Sintering additives such as 6 wt% $Y_2O_3$+1wt% $A1_2O_3$ (6YlA) did not give rise to full densification, while full densification was obtained by using the sintering additives such as 6wt% $Y_2O_3$+3 wt% $A1_2O_3$+ 2wt% $SiO_2$ (6Y3A2S) and 9wt% $Y_2O_3$+ 1.5wt% $A1_2O_3$+ 3wt% $SiO_2$ (9Yl.5A3S). In the case of 6Y3A2S addition, high fracture strength of 960 MPa and the fracture toughness of $6.5 MPa.m^{1/2}$ were obtained.ⴋ崀Ԁ歩楥攞í閜귬ꆰ藬ꂄ냬蒤蓭閙谀

Key words: Sintered reaction-bonded silicon nitride, Coarse Si powders, Sintering additive, Densification