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J. Korean Ceram. Soc. > Volume 38(7); 2001 > Article
Journal of the Korean Ceramic Society 2001;38(7): 628.
전자 패키징용 Pb Free 저융점 유리의 제조
최승철, 이창식, 유재륜, 정경원1
아주대학교 재료공학과
Fabrication of Pb Free Solder Glass for Electronic Packaging Application
Key words: Lead free glass, Bi based solder glass, Softening temperature, Thermal expansion, Relative dielectric constant
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