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Journal of the Korean Ceramic Society 1999;36(5): 490. |
| 고주파용 저온 동시소성 세라믹(LTCC)칩 커플러 제조: II. Ag 이온 확산에 대한 소결공정의 영향 |
| 이선우, 김경훈1, 심광보1, 구기덕2 |
한양대학교 세라믹소재 연구소
1한양대학교 세라믹공정연구센터
2(주)케이세라 |
| Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies ; II. Effect of Sintering Process on Ag Diffusion |
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| ABSTRACT |
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The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{circ}C$-975$^{circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions. |
| Key words:
LTCC, Ag diffusion, Coupler, Microstructure, Glass |
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