Low Temperature Firing Ceramic Substrates for IC Package

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J. Korean Ceram. Soc. > Volume 29(2); 1992 > Article

Journal of the Korean Ceramic Society 1992;29(2): 83.

저온 소결성 세라믹 기판재료

김정돈, 손용배, 주기태, 장성도

한국과학기술연구원 기능요업연구실

Low Temperature Firing Ceramic Substrates for IC Package

ABSTRACT

New ceramic substrates firable at low temperature (<1000$^{circ}C$) were prepared with mixture of alumina and glass powders in CaO-Al2O3-SiO2 system. The substrate of alumina 40 wt% and glass 60 wt%, which was fired between 900∼1000$^{circ}C$, shows low dielectric constant (5∼8 at 1 MHz), specific gravity of 3.10, relatively low thermal expansion coefficient (5.5${times}$10-6/$^{circ}C$ at 40∼500$^{circ}C$) and excellent surface roughness (0.4∼0.5 ${mu}$Ra). These properties were thought to be superior to those of conventional Al2O3 ceramic substrates.