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J. Korean Ceram. Soc. > Volume 26(6); 1989 > Article
Journal of the Korean Ceramic Society 1989;26(6): 829.
IC Package 봉착용 결정화 유리의 제조와 특성에 관한 연구
손명모, 감직상1, 박희찬2, 이서우2, 문종수3
대구공업전문대 요업과
1KAIST 내열 세라믹스 연구실
2부산대학교 무기재료공학과
3경남대학교 무기재료공학과
Preparation and Characterization of Solder Glass for Electronic IC Package
Devitrifing solder glasses in a specific group of glass ceramic materials are extensively used in hermetically sealing alumina electronics packages. Preferred frit glass compositions of this study consist of 37~40wt% PbO, 35~40wt% ZnO, 18~20wt% B2O3, 1~3wt% SiO2, 0~6wt% TiO2. The coated frit glasses crystallize during firing and form a strong hermetic seal. DTA and X-ray diffraction were used to characterize crystallization of the glass frit. Frit seal containing 2wt% TiO2 has crystallization temperature of 550~57$0^{circ}C$ with surface nucleation. Frit seal containing 6wt% TiO2 has crystallization temperature of 515~5$25^{circ}C$ with bulk nucleation, and the main crystalline phase was perovskite lead titanate having minus expansion coefficient. The average activation energy for the crystallization calculated from Ozawa equation was 65$pm$10kcal/mol.
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