PublisherDOIYearVolumeIssuePageTitleAuthor(s)Link
Journal of the Korean Ceramic Society10.4191/kcers.2016.53.1.43201653143-49Mixing Rules of Young’s Modulus, Thermal Expansion Coefficient and Thermal Conductivity of Solid Material with Particulate InclusionYoshihiro Hirata, Taro Shimonosonohttp://www.jkcs.or.kr/upload/pdf/jkcs-53-1-43.pdf, http://www.jkcs.or.kr/journal/view.php?doi=10.4191/kcers.2016.53.1.43, http://www.jkcs.or.kr/upload/pdf/jkcs-53-1-43.pdf
Carbon10.1016/j.carbon.2014.07.068201479274-293Young’s modulus, thermal conductivity, electrical resistivity and coefficient of thermal expansion of mesophase pitch-based carbon fibersFrancisco G. Emmerichhttps://api.elsevier.com/content/article/PII:S0008622314007064?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0008622314007064?httpAccept=text/plain
Ceramics International10.1016/j.ceramint.2014.10.08520154122706-2713Representation of thermal expansion coefficient of solid material with particulate inclusionYoshihiro Hiratahttps://api.elsevier.com/content/article/PII:S0272884214016101?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0272884214016101?httpAccept=text/plain
Ceramics International10.1016/j.ceramint.2009.03.03820093572921-2926Representation of thermal conductivity of solid material with particulate inclusionYoshihiro Hiratahttps://api.elsevier.com/content/article/PII:S0272884209001655?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0272884209001655?httpAccept=text/plain
Materials Science Forum10.4028/www.scientific.net/msf.620-622.7152009620-622715-718Development of Porous Material with High Young’s Modulus and Low Thermal Expansion Coefficient in SiC-Vitrified Bonding Material-LiAlSiO<sub>4</sub> SystemTatsuya Ono, Koji Matsumaru, Isaías Juárez-Ramírez, Leticia M. Torres-Martínez, Kozo Ishizakihttps://www.scientific.net/MSF.620-622.715.pdf
Journal of Materials Science10.1007/s10853-009-3365-320094482167-2170A new method to experimentally determine the thermal expansion coefficient, Poisson’s ratio and Young’s modulus of thin filmsE. Çetinörgühttps://link.springer.com/article/10.1007/s10853-009-3365-3/fulltext.html, https://link.springer.com/content/pdf/10.1007/s10853-009-3365-3.pdf, http://link.springer.com/content/pdf/10.1007/s10853-009-3365-3, https://link.springer.com/content/pdf/10.1007/s10853-009-3365-3.pdf
Solid State Communications10.1016/j.ssc.2005.01.03120051344271-276Unusual thermal conductivity of the negative thermal expansion material, ZrW2O8Catherine A. Kennedy, Mary Anne Whitehttps://api.elsevier.com/content/article/PII:S0038109805000608?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0038109805000608?httpAccept=text/plain
Science China Technological Sciences10.1007/s11431-018-9227-82018615687-698Size- and temperature-dependent Young’s modulus and size-dependent thermal expansion coefficient of nanowiresHongLiang Sun, LiuYan Chen, Sheng Sun, Tong-Yi Zhanghttp://link.springer.com/article/10.1007/s11431-018-9227-8/fulltext.html, http://link.springer.com/content/pdf/10.1007/s11431-018-9227-8.pdf, http://link.springer.com/content/pdf/10.1007/s11431-018-9227-8.pdf
Journal of Applied Polymer Science10.1002/(sici)1097-4628(19991227)74:14<3396::aid-app13>3.0.co;2-3199974143396-3403Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packagingC. P. Wong, Raja S. Bollampallyhttps://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2F(SICI)1097-4628(19991227)74:14%3C3396::AID-APP13%3E3.0.CO;2-3, https://onlinelibrary.wiley.com/doi/full/10.1002/(SICI)1097-4628(19991227)74:14%3C3396::AID-APP13%3E3.0.CO;2-3
Physics of the Solid State10.1134/s106378341405024220145651006-1008Modulus of elasticity and thermal expansion coefficient of glassy solidsD. S. Sanditov, B. S. Sydykovhttp://link.springer.com/content/pdf/10.1134/S1063783414050242.pdf, http://link.springer.com/article/10.1134/S1063783414050242/fulltext.html, http://link.springer.com/content/pdf/10.1134/S1063783414050242