Densification of Reaction Bonded Silicon Nitride with the Addition of Fine Si Powder - Effects on the Sinterability and Mechanical Properties
Sea-Hoon Lee, Chun-Rae Cho, Young-Jo Park, Jae-Woong Ko, Hai-Doo Kim, Hua-Tay Lin, Paul Becher
J. Korean Ceram. Soc. 2013;50(3):218     DOI: https://doi.org/10.4191/kcers.2013.50.3.218
Citations to this article as recorded by Crossref logo
Enhanced thermal conductivity and flexural strength of sintered reaction‐bonded silicon nitride with addition of (Y0.96Eu0.04)2O3
Shishuai Li, Yongfeng Xia, Dongxu Yao, Hanqin Liang, Yu‐Ping Zeng
International Journal of Applied Ceramic Technology.2023; 20(1): 465.     CrossRef
Sintering Behavior and Properties of Reaction-Bonded Silicon Nitride
S. N. Perevislov
Russian Journal of Applied Chemistry.2021; 94(2): 143.     CrossRef
Rheology and Curability Characterization of Photosensitive Slurries for 3D Printing of Si3N4 Ceramics
Xingbang Li, Jingxian Zhang, Yusen Duan, Ning Liu, Jinhua Jiang, Ruixin Ma, Hongan Xi, Xiaoguang Li
Applied Sciences.2020; 10(18): 6438.     CrossRef
Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive
Shin-Il Go, Yinsheng Li, Jae-Woong Ko, Ha-Neul Kim, Se-Hun Kwon, Hai-Doo Kim, Young-Jo Park
Advances in Materials Science and Engineering.2018; 2018: 1.     CrossRef
Effect of Si addition on the mechanical and thermal properties of sintered reaction bonded silicon nitride
Wenjie Li, Youliang Wu, Rongxia Huang, Shunda Ye, Hua-Tay Lin
Journal of the European Ceramic Society.2017; 37(15): 4491.     CrossRef
Fabrication of Si3N4 ceramics by post-reaction sintering using Si–Y2O3–Al2O3 nanocomposite particles prepared by mechanical treatment
Kwangjin Jeong, Junichi Tatami, Motoyuki Iijima, Takuma Takahashi
Ceramics International.2016; 42(10): 11554.     CrossRef
Flexural Strength and Dielectric Properties of in-situ Si3N4-SiO2-BN Composite Ceramics
Hyun Min Lee, Seung Jun Lee, Seungsu Baek, Do Kyung Kim
Journal of the Korean Ceramic Society.2014; 51(5): 386.     CrossRef