| Glass Frit의 입도가 MLCC 외부전극 Paste의 소결거동에 미치는 영향 |
| 이규하, 전병준, 김창훈, 권영근, 박명준, 구현희, 엄지원, 김영태, 허강헌1 |
삼성전기 LCR 재료개발 그룹
1삼성전기 LCR 개발팀 |
| Effects of Glass Frit Size on the Sintering Behavior of Cu Termination Paste in MLCC |
| Kyu-Ha Lee, Byung-Jun Jeon, Chang-Hoon Kim, Young-Geun Kwon, Myung-Jun Park, Hyun-Hee Gu, Ji-Won Uhm, Young-Tae Kim, Kang-Heon Hur1 |
LCR Material Development Group, Samsung Electro-Mechanics
1LCR Development Team, Samsung Electro-Mechanics |
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| ABSTRACT |
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Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${mu}m$, 0.5 ${mu}m$, 1.0 ${mu}m$, 4.0 ${mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification. |
| Key words:
MLCCs, Termination electrode, Glass frit, Paste, Glass firt size, Sintering, Dispersion |
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