Miniaturized Multilayer Band Pass Chip filter for IMT-2000

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doi:2003.40.10.961

J. Korean Ceram. Soc. > Volume 40(10); 2003 > Article

Journal of the Korean Ceramic Society 2003;40(10): 961.
doi: https://doi.org/10.4191/kcers.2003.40.10.961

IMT-2000용 초소헝 적층형 대역 통과 칩 필터 설계 및 제작

임혁, 하종윤¹, 심성훈¹, 강종윤¹, 최지원¹, 최세영², 오영제¹, 김현재¹, 윤석진²

한국과학기술연구원 박막재료연구센터, 연세대학교 세라믹공학과
¹한국과학기술연구원 박막재료연구센터
²연세대학교 세라믹공학과

Miniaturized Multilayer Band Pass Chip filter for IMT-2000

ABSTRACT

A Multi-Layer Ceramic (MLC) chip type Band-Pass Filter (BPF) using BiNb$_$0.975/Sb$_$0.025/ $O_4$ LTCC (Low Temperature Co-fired Ceramics) and MLC processing is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coupled stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The attenuation pole depends on the coupling between resonators and the coupling capacitance. An equivalent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the manufactured BPF is well acceptable for IMT-2000 application.

Key words: LTCC, BPF, IMT-2000, MLC