Machining of Diamond Films with Copper Vapor Laser

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J. Korean Ceram. Soc. > Volume 35(1); 1998 > Article

Journal of the Korean Ceramic Society 1998;35(1): 41.

구리증기레이저를 이용한 다이아몬드막의 가공

박영준, 백영준

한국과학기술연구원 박막기술연구센터

Machining of Diamond Films with Copper Vapor Laser

ABSTRACT

Cutting and planarization of diamond films have been performed using copper vapor laser under air at-mosphere. Diamond films of about 350${mu}{textrm}{m}$ and 800 ${mu}{textrm}{m}$ thick have been synthesized with DC plasma assisted chemical vapor deposition. The position of a specimen has been controlled by computer-driven stage. With copper vapor laser beam of 7W cutting depth increases rapidly and saturates with increasing scan number and decreasing scan speed. 8 repetitive scans at scan speed 0.5 mm/sec produce the maximum cutting depth without focus shifting Rod-shape copper vapor laser beam can be made and used effectively in planar-ization of rough diamond surface.

Key words: Copper vapor laser, Diamond films, Laser machining