Effect of Oxygen Partial Pressure on Tungsten-Alumina Bonding Behavior

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J. Korean Ceram. Soc. > Volume 27(6); 1990 > Article

Journal of the Korean Ceramic Society 1990;27(6): 755.

텅스텐-알루미나 접합거동에 미치는 산소분압의 영향

박정현, 이상진

연세대학교 공과대학 요업공학과

Effect of Oxygen Partial Pressure on Tungsten-Alumina Bonding Behavior

ABSTRACT

The tungsten paste was printed on the surface of 92% alumina sheet which was made by type casting process. The printed tungsten was bonded on the Al2O3 by co-firing in reducing atmosphere. During the co-firing, the binder burn-out was easier in wet H2 atmosphere than in dry H2, which affected sintered density. In practically, the use of wet H2 above 100$0^{circ}C$ was beneficial for density of alumina and bond strength. This phenomena occured more distinctly when atmosphere varied from dry H2 to wet H2 than varied dew point in wet H2. In wet H2, the improvement in bonding strength can be attributed to good glass migration into the metal layer due to inhibition of the tungsten particle growth, with increase of alumina density, at the temperatrue higher than 100$0^{circ}C$.