| 변형된 실리콘의 미세구조와 기계적 거동 |
| 김성원, 김형태, Jian-Min Zuo1, Jerome Pacaud2 |
한국세라믹기술원 엔지니어링세라믹센터
1Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
2Lab de Metallurgie Physique, University of Poitiers |
| The Microstructure and Mechanical Behavior of Deformed Silicon |
| Seong-Won Kim, Hyung-Tae Kim, Jian-Min Zuo1, Jerome Pacaud2 |
Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology
1Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
2Lab de Metallurgie Physique, University of Poitiers |
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| ABSTRACT |
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The microstructure and mechanical behavior of deformed silicon were characterized using transmission electron microscopy and nanoindentation. Structural defects such as stacking faults and dislocations were observed through the diffraction contrast in transmission electron microscopy. The mechanical properties of deformed Si and 111 Si wafer and mechanical behaviors during contact loading were also characterized using nanoindentation. The hardness values of silicon samples were ${sim}10$ GPa and the elastic modulus were varied with indentation conditions. Elbow or pop-out behaviors were found in load-displacement curves of silicon samples during nanoindentation. Deformed silicon showed 'pop-out' behavior more frequently under the load of 10 mN, which is attributed to the structural defects in deformed silicon. |
| Key words:
Deformed silicon, Microstructure, Mechanical behavior, Nanoindentation |
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