| LTCC 내장형 미세 라인 인덕터 구현을 위한 감광성 Ag Paste 조성에 관한 연구 |
| 이상명, 박성대, 유명재, 이우성, 강남기, 남산1 |
전자부품연구원 전자소재패키징연구센터
1고려대학교 신소재공학과 |
| Study on the Compositions of Photosensitive Ag Paste for Patterning Embedded Fine-Line Inductor in LTCC |
| Sang-Myoung Lee, Seong-Dae Park, Myong-Jae Yoo, Woo-Sung Lee, Nam-Kee Kang, Sahn Nahm1 |
Electronic Materials Packaging Research Center, Korea Electronics Technology Institute
1Department of Materials Science and Engineering, Korea University |
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| ABSTRACT |
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Line width under $100;{mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30;{mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield. |
| Key words:
Ag Paste, LTCC, Thick film lithography, Embedded inductor |
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